Electronics Component & Packaging (ECP) Soldering
Air Liquide has supported the electronics manufacturing industry with solutions for every step of their processes from assembly through testing, storage and cleaning.
ECP Soldering at a Glance
Our Offer
As assembly is a focused core process, we offer solutions to achieve controlled nitrogen atmospheres, thereby reducing the negative effects of oxidation for wave or reflow soldering. The Nexelia™ offers for electronics manufacturing include the following solutions:
- Nexelia™ for Wave Soldering is a solution dedicated to the wave soldering process. It includes patented customized application equipment, right inert gas supply and the support of our worldwide experts.
- Nexelia™ for Reflow Soldering is a solution dedicated to reflow soldering process. It involves deep-level inspection and diagnostics to understand the customer’s assembly processes and propose a tailored solution to improve them.
Our Gases
Related Industries
All-in-One-Solution
Why Choose Us
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Industry Leader
We are a global leader in gases, technologies and services for Industry and Health. -
Reliability
Our solutions are reliable, reproducible and in compliance with stringent and ever-evolving regulations. -
Expertise
Leverage our global network of industry experts tailored to your unique challenges. -
One-Stop Solution Provider
Access a comprehensive suite of products, supply modes, and services designed for your specific requirements. -
Extensive Infrastructure Network
Benefit from our robust production and filling infrastructure, including extensive pipeline networks. -
Focus on Quality
Expect nothing less than the highest standards in process and product quality. -
Sustainability
Embrace our solutions that support your highest performance while minimising environmental impact.
What can we do for you?
Applications
What's next?